Wrought Copper Alloys: Coppers (C10100 - C15999)

Standard Designation for Wrought Copper Alloys

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UNS #	Cu		Pb		Zn		Fe		P		Al		Ag		As		B		O		Sb		Te		Other Named Elements		Status
UNS #	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Min%	Max%	Status
C10100* Oxygen-Free-Electronic OFE	99.99⁽¹⁾⁽²⁾⁽³⁾			0.0005		0.0001		0.0010		0.0003				0.0025		0.0005				0.0005		0.0004		0.0002			active
C10200* Oxygen-Free OF	99.95⁽⁴⁾⁽¹⁾⁽⁵⁾																			0.0010							active
C10300* Oxygen-Free Copper OFXLP	99.95⁽⁵⁾⁽⁶⁾								0.001	0.005																	active
C10400* Oxygen-Free with Ag OFS	99.95⁽¹⁾⁽⁵⁾⁽⁴⁾												0.027⁽⁷⁾							0.0010							active
C10500* Oxygen-Free with Ag OFS	99.95⁽¹⁾⁽⁵⁾⁽⁴⁾												0.034⁽⁸⁾							0.001							active
C10700* Oxygen-Free with Ag OFS	99.95⁽⁵⁾⁽⁴⁾⁽¹⁾												0.085⁽⁹⁾							0.001							active
C10800* OFLP	99.95⁽⁶⁾⁽⁵⁾								0.005	0.012																	active
C10850 Oxygen-Free with Mg MOFC-HR	99.95⁽¹⁰⁾⁽¹¹⁾																								0.0020 Mg	0.0130 Mg	active
C10900* Oxygen-Free	99.99⁽⁵⁾																									0.001 Bi	inactive 03/11
C10910*	99.95⁽¹¹⁾⁽⁵⁾																			0.005							active
C10920*	99.90⁽⁵⁾																			0.02							active
C10930*	99.90⁽⁵⁾												0.044⁽¹²⁾							0.02							active
C10940*	99.90⁽⁵⁾												0.085⁽⁹⁾							0.02							active
C11000* Electrolytic Tough Pitch ETP	99.90⁽¹³⁾⁽¹¹⁾⁽⁵⁾																										active
C11010* Remelted High Conducivity RHC	99.90⁽⁵⁾⁽¹³⁾⁽¹¹⁾																										active
C11020* Fire-Refined High Conductivity FRHC	99.90⁽¹¹⁾⁽¹³⁾⁽⁵⁾																										active
C11025* Fire Refined High Conductivity FRHC	99.90⁽¹⁴⁾⁽¹⁵⁾⁽⁵⁾		0.0150	0.0450		0.0080		0.0020						0.0150		0.0010			0.0100	0.0400		0.0050		0.0010			active
C11030* Chemically Refined Tough Pitch CRTP	99.90⁽⁵⁾⁽¹¹⁾⁽¹³⁾																										active
C11040*	99.90⁽¹⁶⁾⁽¹⁷⁾⁽¹¹⁾			0.0005				0.0010						0.0025		0.0005			0.0100	0.0650		0.0004		0.0002			active
C11045* ETP ETP	99.90⁽¹⁸⁾⁽⁵⁾			0.0005				0.0010						0.0025		0.0005			0.0100	0.0650		0.0004		0.0002			active
C11050 ETP-R	99.90⁽¹⁹⁾			0.0005				0.0030						0.0025		0.0005			0.0100	0.0650		0.0004		0.0002			active
C11080 Replaced by C13100	99.8⁽⁵⁾																										inactive 03/92
C11100* Electronic Tough Pitch, Anneal Resistant ETP	99.90⁽²⁰⁾⁽⁵⁾⁽¹¹⁾																										active
C11300* Tough Pitch with Ag STP	99.90⁽⁵⁾⁽¹³⁾⁽¹¹⁾												0.027⁽⁷⁾														active
C11400* Tough Pitch with Ag STP	99.90⁽¹³⁾⁽⁵⁾⁽¹¹⁾												0.034⁽⁸⁾														active
C11500* Tough Pitch with Ag STP	99.90⁽¹³⁾⁽¹¹⁾⁽⁵⁾												0.054⁽²¹⁾														active
C11600* Tough Pitch with Ag STP	99.90⁽¹¹⁾⁽⁵⁾⁽¹³⁾												0.085⁽⁹⁾														active
C11700*	99.9⁽⁵⁾⁽²²⁾									0.04							0.004	0.02									active
C11900* Copper Alloy	99.93⁽⁵⁾								0.002	0.010																	inactive 02/73
C11904* Copper Alloy	99.90⁽⁵⁾												0.027⁽²³⁾														inactive 03/92
C11905* Copper Alloy	99.90⁽⁵⁾												0.034⁽⁸⁾														inactive 03/92
C11906	99.90												0.054														inactive
C11907* Copper Alloy	99.90⁽⁵⁾												0.085⁽⁹⁾														inactive 03/92
C12000* Phosphorus-Deoxidized, Low Residual P DLP	99.90⁽⁵⁾								0.004	0.012																	active
C12100* Phosphorus-Deoxidized, Low Residual P DLPS	99.90⁽⁵⁾								0.005	0.012			0.014⁽²⁴⁾														active
C12200* Phosphorus-Deoxidized, High Residual P DHP	99.9⁽²⁵⁾⁽⁵⁾								0.015	0.040																	active
C12210*	99.90⁽⁵⁾								0.015	0.025																	active
C12220*	99.9⁽⁵⁾								0.040	0.065																	active
C12300* Phosphorus-Deoxidized, High Residual P DHPS	99.90⁽⁵⁾								0.015	0.040				0.014⁽²⁴⁾													active
C12500* Fire-Refined Tough Pitch FRTP	99.88⁽⁵⁾			0.004												0.012						0.003		0.025⁽²⁶⁾		0.050 Ni 0.003 Bi	active
C12510*	99.9⁽⁵⁾			0.020		0.080		0.05		0.03												0.003		0.025⁽²⁶⁾		0.05 Sn 0.050 Ni 0.005 Bi	active
C12600	99.5⁽⁵⁾								0.20	0.40																	active
C12700* Copper Alloy	99.88⁽⁵⁾			0.004									0.027⁽²³⁾			0.012						0.003		0.025⁽²⁶⁾		0.050 Ni 0.003 Bi	inactive 03/92
C12800* Copper Alloy	99.76⁽⁵⁾			0.004									0.034⁽⁸⁾			0.012						0.003		0.025⁽²⁶⁾		0.050 Ni 0.003 Bi	inactive 03/92
C12900* Fire-Refined Tough Pitch with Ag FRSTP	99.88⁽⁵⁾			0.004										0.054⁽²¹⁾		0.012						0.003		0.025⁽²⁷⁾		0.050 Ni 0.003 Bi	active
C13000 Copper Alloy	99.88⁽⁵⁾			0.004									0.085⁽⁹⁾			0.012						0.003		0.025⁽²⁶⁾		0.05 Ni 0.003 Bi	inactive 03/92
C13100*	99.8⁽⁵⁾																										active
C13150* Copper	99.5⁽⁵⁾																										active
C13400* Copper Alloy	99.99⁽⁵⁾									0.0005			0.027⁽²³⁾														inactive 12/72
C13500* Copper Alloy	99.99⁽⁵⁾									0.0005			0.034⁽⁸⁾														inactive 12/72
C13600* Copper Alloy	99.99⁽⁵⁾									0.0005			0.054⁽²¹⁾														inactive 12/72
C13700* Copper Alloy	99.99⁽⁵⁾									0.0005			0.085⁽⁹⁾														inactive 12/72
C14100 Copper Alloy	99.40⁽⁵⁾														0.15	0.50											inactive 07/74
C14180*	99.90⁽⁵⁾			0.02						0.075		0.01															active
C14181*	99.90⁽⁵⁾			0.002		0.002				0.002																0.005 C 0.002 Cd	active
C14200* Phosphorus-Deoxidized, Arsenical DPA	99.4⁽⁵⁾								0.015	0.040					0.15	0.50											active
C14210* Copper Alloy	99.20⁽⁵⁾								0.013	0.050					0.30	0.50											inactive 03/92
C14300* Cadmium Copper, Deoxidized	99.90⁽⁵⁾⁽²⁸⁾																								0.05 Cd	0.15 Cd	active
C14310* Cadmium Copper	99.90⁽⁵⁾⁽²⁸⁾																								0.10 Cd	0.30 Cd	inactive 03/92
C14400* Copper Alloy	99.90⁽⁵⁾					0.05		0.03	0.013	0.025												0.003		0.02	0.10 Sn	0.20 Sn 0.05 Ni	inactive 03/92
C14410*	99.90⁽²⁹⁾⁽⁵⁾			0.05				0.05	0.005	0.020															0.10 Sn	0.20 Sn	active
C14415*	99.96⁽²⁹⁾																								0.10 Sn	0.15 Sn	active
C14420*	99.90⁽⁵⁾⁽³⁰⁾																						0.005	0.05	0.04 Sn	0.15 Sn	active
C14425 Copper Copper	99.97⁽³¹⁾⁽⁵⁾			0.10		0.10		0.020		0.010															0.25 Sn	0.35 Sn 0.020 Ni⁽³²⁾	active
C14430* Copper Alloy		Rem⁽⁵⁾																							0.25 Sn	0.35 Sn	inactive 03/92
C14435	99.4⁽³³⁾																			0.001					0.30 Sn	0.60 Sn	active
C14440* Copper Alloy	99.96⁽⁵⁾																								0.005 Sn	0.01 Sn	inactive 03/92
C14500* Tellurium-Bearing PTE	99.90⁽³⁴⁾⁽³⁵⁾⁽⁵⁾								0.004	0.012													0.40	0.7			active
C14510* Tellurium-Bearing	99.85⁽³⁴⁾⁽⁵⁾			0.05					0.010	0.030													0.30	0.7			active
C14520* Phosphorus-Deoxidized,Tellurium-Bearing DPTE	99.90⁽³⁴⁾⁽⁵⁾								0.004	0.020													0.40	0.7			active
C14530*	99.90⁽³⁶⁾								0.001	0.010													0.003⁽³⁷⁾	0.023	0.003 Sn	0.023 Sn	active
C14700* Sulfur-Bearing	99.90⁽⁵⁾⁽³⁸⁾⁽³⁵⁾								0.002⁽³⁸⁾	0.005															0.20 S	0.50 S⁽³⁸⁾	active
C14710* Copper Alloy	99.90⁽³⁵⁾⁽³⁹⁾			0.05⁽³⁹⁾					0.010⁽³⁹⁾	0.030															0.05 S	0.15 S⁽³⁹⁾	inactive 03/92
C14720 Copper Alloy	99.50⁽³⁸⁾⁽³⁵⁾⁽⁵⁾			0.1					0.010	0.030⁽³⁸⁾															0.20 S⁽³⁸⁾	0.50 S	inactive 03/92
C14730 Sulfur Bearing Copper	99.80⁽⁵⁾																										inactive 03/92
C14750* High Copper Alloy		Rem⁽⁵⁾⁽⁴⁰⁾								0.012															0.05 Mn 0.20 S	0.50 Mn 0.50 S	active
C15000* Zirconium Copper		Rem⁽⁵⁾⁽⁴¹⁾																							0.10 Zr	0.20 Zr	active
C15100*	99.80⁽⁴¹⁾⁽⁵⁾																								0.05 Zr	0.15 Zr	active
C15150*	99.90⁽⁵⁾																								0.015 Zr	0.030 Zr	active
C15500*	99.75⁽⁵⁾								0.040	0.080			0.027	0.10⁽²³⁾											0.08 Mg	0.13 Mg	active
C15600* Copper Alloy	99.6⁽⁵⁾								0.06	0.09															0.20 Co	0.30 Co 0.02 Mg	active
C15630		Rem⁽⁴²⁾							0.015	0.040															0.60 Ni	0.90 Ni	active
C15650* MA5J Copper	99.9⁽⁵⁾								0.015	0.040															0.04 Co	0.06 Co	active
C15710* Copper Alloy	99.71⁽⁵⁾			0.01				0.01			0.08	0.12							0.07	0.15							inactive 03/92
C15715* Dispersion Strengthened Alloy	99.62⁽⁵⁾			0.01				0.01			0.13	0.17⁽⁴³⁾							0.12⁽⁴³⁾	0.19							active
C15720* Dispersion Strengthned Alloy	99.52⁽⁵⁾			0.01				0.01			0.18⁽⁴³⁾	0.22							0.16	0.24⁽⁴³⁾							active
C15725* Dispersion Strengthened Alloy	99.43⁽⁵⁾			0.01				0.01			0.23⁽⁴³⁾	0.27							0.20⁽⁴³⁾	0.28							active
C15730* Copper Alloy	98.94⁽⁵⁾							0.04			0.26	0.34⁽⁴³⁾						0.22	0.32⁽⁴³⁾	0.46							active
C15735* Copper Alloy	99.24⁽⁵⁾			0.01				0.01			0.33	0.37							0.29	0.37							inactive 03/92
C15750* Dispersion Strengthened Copper C3/60	98.56⁽⁵⁾							0.04			0.42⁽⁴³⁾	0.50						0.22	0.52	0.68⁽⁴³⁾							active
C15760* Dispersion Strengthened Alloy	98.77⁽⁵⁾			0.01				0.01			0.58⁽⁴³⁾	0.62							0.52	0.59⁽⁴³⁾							active
C15780* Copper Alloy	98.10⁽⁵⁾							0.04			0.66⁽⁴³⁾	0.74						0.22	0.76⁽⁴³⁾	0.90							active
C15790* Copper Alloy	97.68⁽⁵⁾							0.04			0.88⁽⁴³⁾	0.96						0.22	0.96⁽⁴³⁾	1.10							active
C15815* Dispersion Strengthened Alloy	97.82⁽⁵⁾			0.01				0.01			0.13	0.17⁽⁴³⁾					1.2	1.8		0.19⁽⁴³⁾							active
C15900* Dispersion Strengthened Coper C3/11	97.51⁽⁵⁾							0.04			0.76	0.84⁽⁴³⁾							0.40⁽⁴³⁾	0.54					0.27 C 0.66 Ti	0.33 C 0.74 Ti	active
* = are alloys registered with the U.S. EPA as Antimicrobial.
(1) = This is a high conductivity copper which has, in the annealed condition a minimum conductivity of 100% IACS except for Alloy C10100 which has a minimum conductivity of 101% IACS.
(2) = Cu is determined by the difference between the impurity total and 100 %. For alloy C10100 the Cu value is exclusive of Ag.
(3) = The following additional impurity maximum limits shall apply: Bi 1ppm (0.0001%); Cd 1ppm (0.0001%); Mn 0.5ppm (0.00005%); Ni 10ppm (0.0010%); Se 3ppm (0.0003%); S 15ppm (0.0015%); Sn 2ppm (0.0002).
(4) = Cu is determined by the difference between the impurity total and 100%.
(5) = Cu value includes Ag.
(6) = Includes P.
(7) = Ag 0.027% min is the equivalent of, Ag 8 Troy Oz min.
(8) = Ag 0.034% min is the equivelant of, Ag 10 Troy Oz min.
(9) = Ag 0.085% min is the equivelant of, Ag 25 Troy Oz min.
(10) = Cu + Sum of Named Elements, 99.95% min.
(11) = This is a high conductivity copper which has, in the annealed condition a minimum conductivity of 100% IACS.
(12) = Ag 0.044% min is the equivelant of, Ag 13 Troy Oz min.
(13) = Oxygen and trace elements may vary depending on the process.
(14) = The following additional maximum limits shall apply: Se 10 ppm (0.0010%); Bi 5 ppm (0.0005%); Sn 150 ppm (0.0150%); Ni 150 ppm (0.0150%); S 20 ppm (0.0020%); Cd 100 ppm (0.0100%).
(15) = The total maximum allowable of named elements is 750 ppm (0.0750%) not including oxygen.
(16) = Cu value is exclusive of Ag
(17) = The following additional maximum limits shall apply: Se 2ppm (0.0002%); Bi 1.0ppm (0.00010%); Group Total Te + Se +Bi 3ppm(0.0003%); Sn 5ppm (0.0005%); Ni 10ppm (0.0010%); S 15ppm (0.0015%). The total maximum allowable of named elements is 65 ppm (0.0065%) - does not include oxygen.
(18) = These total maximum limits shall apply; Se 2ppm(0.0002%); Bi 0.5ppm (0.00005%); Sn 5 ppm (0.0005%); Ni 10ppm (0.0010%); S 15 ppm (0.0015%).
(19) = The following additional impurity maximum limits shall apply: Bi 1 ppm (0.0015%); Ni 15 ppm (0.0015%); S 15 ppm (0.0015%); Se 2 ppm (0.0002%); Sn 15 ppm (0.0015%);
(20) = Small amounts of Cd or other elements may be added by agreement to improve the resistance to softening at elevated temperatures.
(21) = Ag 0.054% min is the equivelant of, Ag 16 Troy Oz min.
(22) = Includes B + P.
(23) = Ag 0.027 - 0.10% min is the equivalent of, Ag 8 - 30 Troy Oz min.
(24) = Ag 0.014% min is the equivalent of, Ag 4 Troy Oz min.
(25) = This includes oxygen-free Cu which contains P in an amount agreed upon.
(26) = 0.025 Te + Se.
(27) = Includes Te + Se.
(28) = Includes Cd. Deoxidized with Li or other suitable elements as agreed upon.
(29) = Includes Cu + Ag + Sn.
(30) = Includes Te + Sn.
(31) = Cu + Sum of Named Elements, 99.97% Min.
(32) = Includes Co.
(33) = Cu + Sum of Named Elements 99.7% min.
(34) = Includes Te + P.
(35) = Includes oxygen-free or deoxidized grades with deoxidizers (such as phosphorus boron lithium or others in an amount agreed upon.
(36) = Includes Ag + Sn + Te + Se
(37) = Tellurium and/or Selenium
(38) = Includes Cu + S + P.
(39) = Includes Ag, S, P, and Pb
(40) = Cu + Sum of Named Elements 99.8% min.
(41) = Cu + Sum of Named Elements 99.9% min.
(42) = Cu + Sum of Named Elements 99.5% min.
(43) = All aluminum present as Al2O3; 0.04% oxygen present as Cu2O with a negligible amount in solid solution with copper.